Laird Technologies - Item # pn-3196, Mold-In-Place Printed Circuit Board Shielding
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Mold-In-Place Printed Circuit Board Shielding
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Item # pn-3196
Item # pn-3196 Mold-In-Place Printed Circuit Board Shielding
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Laird Technologies introduces its Series #8557 mold-in-place capabilities for printed circuit board shielding applications. Based upon each specific design application, a molded in- place rib pattern, made of silver or silver coated particles in a silicone base, can be applied to any metal substrate creating a multi-compartment, shielded enclosure. During installation, the shield is sandwiched between one side of the printed circuit board and the housing. As the housing is assembled, the mold-in-place ribs are compressed, providing the shield. Access to the components is accomplished by simple disassembly of the housing.
The mold-in-place rib enclosure design is ideally suited for portable devices, hand held computers, and wireless communications devices.
Laird Technologies can custom mold-in-place on your provided substrates, or you can utilize our vast metal stamping technology and have us manufacture the substrate.To order, please specify desired rib pattern and provide a layout of the designed matching ground traces on theprinted circuit board.
Features
Replaces multiple soldered printed circuit board shield cans with a single piece approach
Ideal for hand held devices where space is at a premium
The metal substrate acts as a shielded enclosure allowing the use of a non-conductive housing
Metal component can be custom designed in various shapes, mounting tabs, and heights
Elastomer mold-in-place ribs can be provided with a tapered design to lower compression force
Available in other material compounds
